UV Light Curable Encapsulants for Microelectronic Assembly and IC Protection

NEW!  Hybrid Coat^TM EL-9088

A Truely UV Curable Black Encapsulant

EL-9088 UV Black, Micro-Electronics Encapsulant is a hybrid opaque UV/heat curable adhesive that bonds to various substrates. Designed for use for as a dam and fill material, this product can be effectively cured in less than 3 minutes up to a thickness of 1.25mm. EL-9088 is also commonly used as a potting material of more than 2.5mm in depth and can be effectively cured in 30 mins at 110°C. Formulated to withstand thermal cycles of -40°C to 150°C with improved moisture and thermal resistance.

Hybrid Coat^TM Series of UV Encapsulants offers manufacturers many benefits including faster production speed and capacity, less floor space (eg. special storage conditions), reduction of Work-In-Process, increasing yields and reducing scrap to name a few.

Advantages of Incure's EL-9088

• One Component - No Mixing
• Solvent Free
• Low Odor
• Ease of application, "Ready-To-Use" Product
• Room Temperature Storage
• Shelf Life (6 months)