Blaze Technology Pte Ltd

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Tel : +65 6270 2188  Whatsapp : +65 9756 9909  

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UV Light Curable Encapsulants for Microelectronic Assembly and IC Protection

NEW!  Hybrid CoatTM EL-9088

A Truely UV Curable Black Encapsulant

EL-9088 UV Black, Micro-Electronics Encapsulant is a hybrid opaque UV/heat curable adhesive that bonds to various substrates. Designed for use for as a dam and fill material, this product can be effectively cured in less than 3 minutes up to a thickness of 1.25mm. EL-9088 is also commonly used as a potting material of more than 2.5mm in depth and can be effectively cured in 30 mins at 110°C. Formulated to withstand thermal cycles of -40°C to 150°C with improved moisture and thermal resistance.

Hybrid CoatTM Series of UV Encapsulants offers manufacturers many benefits including faster production speed and capacity, less floor space (eg. special storage conditions), reduction of Work-In-Process, increasing yields and reducing scrap to name a few.

Advantages of Incure's EL-9088

• One Component - No Mixing
• Solvent Free
• Low Odor
• Ease of application, "Ready-To-Use" Product
• Room Temperature Storage
• Shelf Life (6 months)

  Chip-on-Board (COB) Encapsulants and Wire Bonders

    Overview of Product Spectrum
    Product Description
Color Viscosity Shore Elongation  
          cps Hardness %  
    EL-9047 Flexible, High Adhesion, High Moisture Resistance, Bonds to Wide Variety Substrates
Clear 4,000 - 5,000 A85 300  
    EL-9050

Ultra Fast Cure, Low Modulus for Wire Bonding, Secondary Heat Cure for Shadowed Areas

Clear 4,000 - 5,000 D45 150   
    EL-9054

Ultra Fast Cure, Low Modulus for Wire Bonding, Secondary Heat Cure for Shadowed Areas

Clear
15,000 - 17,000 D45 150  
    EL-9062

Moisture and Thermal Resistant, Secondary Heat Cure for Shadowed Areas, Flexible

Clear 15,000 - 17,000 D40 35